材料物理科技英語(yǔ)

目錄Contents
Unit 1 Basis of Materials Science ·············1
1.1 Introduction ···············································1
1.2 Materials Science and Engineering·····················3
1.3 Classification of Materials·······························8
1.4 Advanced Materials ···································· 14
1.5 Microstructure characterization of Materials········ 19
Unit 2 Plasmas ··································· 42
2.1 DC Glow Discharge ···································· 44
2.2 RF Discharges··········································· 47
2.3 High-Density Plasmas ································· 50
Unit 3 Vacuum Technology···················· 59
3.1 Pressure Ranges and Vacuum Pumps ················ 60
3.2 Vacuum Seals and Pressure Measurement··········· 69
Unit 4 Thin Film Deposition ··················· 76
4.1 Physical Deposition ···································· 77
目錄
VI
4.2 Chemical Deposition ··································· 83
4.3 Epitaxial Growth········································ 94
Unit 5 Devices Fabrication Process ······ 102
5.1 Introduction ············································102
5.2 Ion implantation ·······································103
5.3 Photolithography·······································105
5.4 Etch······················································109
5.5 Metallization ··········································· 110
5.6 Process Integration ····································101
Unit 6 Reading Practice······················ 128
6.1 Paper ····················································128
6.2 Patent····················································140
6.3 Manual Guide ··········································147
Unit 7 Writing Practice························ 160
7.1 Structure of Paper······································160
7.2 Example 1 ··············································165
7.3 Example 2 ··············································171